| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacture of a circuit board suitable for high-density mounting where the surface of itself and the surface of an wiring pattern conductor are flattened, by facilitating formation of the fine wiring pattern even if the formation of the wiring pattern is performed by wet processing of photolithography method, in case that this circuit board requires high-density mounting of highly integrated circuit elements, etc., and the circuit board. SOLUTION: An upper mold C and a lower mold D where severally different wiring patterns are made in projection form are arranged on both sides of a resin board 11 in prepreg condition where the through hole 12 is charged with conductive paste 13, and the resin board 11 is hardened by heating and pressing it from both sides, and at the same time recesses 15 in the shape of wiring pattern form are made at both faces of a hardened resin board 14. Then, the recess 15 is charged with wiring pattern conductors 16 such as conductive paste or the like so as to flatten the surface of the resin board 14 and the surface of the wiring pattern conductor 16. |
