| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module which can be assembled without requiring connecting work of a wire for fixing potential. SOLUTION: In a semiconductor module having a semiconductor stack constituted by alternately connecting thyristors 1A and 1B and heat sinks 5A, 5B, and 5C in series, branch cooling water pipes 8A-8I and 9 which distribute cooling water to the heat sinks 5A, 5B, and 5C, resistors 2A and 2B, a reactor 4, etc., are provided. Of the pipes 8A-8I and 9, the pipe 9 which supplies the cooling water to the intermediate heat sink 5B from a cooling water pipe 6B which is maintained at the same potential as that at a frame 7 is made to have electrical conductivity. Therefore, the potential at the frame 7 can be fixed to the intermediate potential of the semiconductor module without connecting any wire for fixing potential. |
