ELECTROLESS PLATING METHOD OF THERMOELECTRIC SEMICONDUCTOR,申请号JP19970351647-传众专利搜索

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发明名称	ELECTROLESS PLATING METHOD OF THERMOELECTRIC SEMICONDUCTOR
摘要
申请公布号	JPH11186619(A)	申请公布日期	1999.07.09
申请号	JP19970351647	申请日期	1997.12.19
申请人	AISIN SEIKI CO LTD	发明人	KATO SEIKI;YANO HIDEO
分类号	C23C18/16;H01L35/34;(IPC1-7):H01L35/34	主分类号	C23C18/16
代理机构		代理人
主权项
地址

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