| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable inspection and length measurement with high precision and high reliability on the basis of an electron beam image (SEM), by reducing image distortion caused by deflection and aberration of an electron optical system, and deterioration of resolution due to defocus, and improving the quality of the electron beam image (SEM). SOLUTION: This measuring apparatus is provided with an electron beam image detection optical system 104 detecting a secondary electron beam image generated from an object to be inspected by an electron beam cast from an electron optical system, optical height detecting apparatus 200a, 200b detecting optically the surface height, a focus control means 109 converging the electron beam on the object in the focusing state by controlling an objective 103 of the electron optical system, a deflection control means 108 correcting image distortion containing magnification error of an electron beam image which is generated on the basis of focus control, and an image processing means 124 performing inspection or measurement of a pattern which is formed on the object on the basis of the secondary electron beam image.</p> |
