| 摘要 |
PROBLEM TO BE SOLVED: To make electrodes easily deformable using their thickness to suppress effects of shearing on other components, by increasing thickness of connecting pads on the board surface or LSI surface. SOLUTION: A manufacturing method comprises the steps of forming an insulation layer 17 on the surface of electrodes formed on a substrate 2, forming a wiring 18 thereon, forming a resin layer 11 on the entire surface in such a wiring pattern, boring the resin layer 11 to expose the wiring 18, forming Cr and Cu plating films, forming a resin layer 13 of a specified thickness thereon, boring this resin layer 13 to fill the holes of the resin layers 11, 13 with a plating film 14, forming a resin thin film 15 partly having windows on the interface of the plating film 14 and the resin layer 13, and fixing solder balls 20 on the resin film 15 windows to form thick electrodes. |
