| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a structure which can realize a small-sized hybrid integrated circuit board. SOLUTION: A frame member 31 is mounted on a hybrid integrated circuit board 30 in such a state that the member 31 can surround elements and the space formed of the circuit board 30 and the frame member 31 is filled up with a resin 40. Since the frame member 31 is mounted on the circuit board 30 and has no roof, the size of a hybrid integrated circuit device can be reduced accordingly and, when locking part 45 are provided to the frame member 31 and locking notches 46 are provided to the circuit board 5, the movement of the frame member 31 can be prevented.</p> |
