发明名称 CONNECTION STRUCTURE FOR WIRING BOARDS
摘要 <p>PROBLEM TO BE SOLVED: To provide a connection structure for wiring boards which has high durability and reliability on connection and is excellent in mass productivity, being used for connection between the power wiring layers in two wiring boards. SOLUTION: A connection structure for two wiring boards has insulating boards 1 and 5, power wiring layers 3 and 6 being made on the surfaces and subjected to the application of large currents of 1A or over, and pads 4 and 7 for connection made at the terminals. Here, metallic metal fittings 8 having engaging parts 8b are joined and fixed to the pads 4 and 7 for connection of each wiring board A and C so that the junction area may be 3 mm<2> or over by conductive adhesives 9, and also both ends of a conductor wire 10, 0.5 mm or over in line diameter are engaged severally with the engaging parts 8b of the metallic metal fittings 8 so as to electrically connect the power wiring layer 3 and 6 of the two wiring boards A and C. A curve is preferably made at one part of the conductive wire 10 or the metallic metal fitting 8.</p>
申请公布号 JPH11186689(A) 申请公布日期 1999.07.09
申请号 JP19970356927 申请日期 1997.12.25
申请人 KYOCERA CORP 发明人 NAKAGAWA SHOICHI;TAKESHITA YOSHIHIRO
分类号 H05K1/14;H05K3/36;(IPC1-7):H05K1/14 主分类号 H05K1/14
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