| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulation board having thick power circuit conductors and high dielectric strength and manufacture thereof for easily realizing such an insulation board. SOLUTION: To the surface of a 2 mm thick Al alloy base metal 1 a 300μm thick Cu plate power circuit conductors 4 patterned by, e.g., the press working, are bonded through a 150μm thick filler-contg. epoxy resin base insulation layer 2 and a 30μm thick filler-contg. epoxy resin adhesive layer 3. The base insulation layer 2 and adhesive insulation layer 3 may be made of the same insulation material or dissimilar ones and the latter layer 3 may be formed only beneath a power circuit conductors 4.
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