| 摘要 |
PROBLEM TO BE SOLVED: To provide a method capable of exactly controlling the amt. of polishing of bearing surfaces in producing combined thin-film magnetic heads formed by laminating induction type thin-film magnetic heads for writing and magneto-resistive thin-film magnetic heads for reading on a substrate. SOLUTION: Recesses are formed on a wafer with metals or metal compd. films as a mask and simultaneously, electrode patterns P inclusive of electrode elements 31 (3/a to 3/e) consisting of the plural materials or metal compd. films respectively varying in the distance from the reference position of a throat height zero flush with the edges of these recessed parts are formed on the wafer. The wafer is then cut to bars. While the amt. of polishing is monitored in accordance with the respective electrical conduction-cutting states of the plural electrode elements of the electrode patterns formed on the respective bars, the end faces of the bars are polished and the bars are cut to the plural combined thin-film magnetic heads having the air bearing surfaces polished in such a manner that the desired throat heights may be obtd. with the respect bearing surfaces. |
