| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a thin type multilayed printed wiring board which has little thickness variations and smooth surface and is suited to highdensity packaging. SOLUTION: The manufacturing method comprises the steps of applying a photo-setting/thermosetting type under-coating 3 to a flame-retardant inner layer circuit board 1 composed of a flame-retardant epoxy resin-impregnated glass cloth board, irradiating an active energy to make tack-free, laminating a Cu foil having a layer insulation adhesive layer, and heating so that the melting viscosity of this adhesive layer does not fall below 10,000 poises, and the under-coating 3 starts the curing reaction with the melting viscosity ranging between 1,000 poises and 10,000 poises prior to the start of the curing reaction of the adhesive layer, thereby finally curing both together. |
