| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a thin type multilayered printed wiring board which has a little thickness variations and smooth surface and is suited for high-density packaging. SOLUTION: This manufacturing method comprises the steps of applying a photo-setting/thermosetting type under-coating 3 to a flame-retardant inner layer circuit board 1 consisting of a flame-retardant epoxy resin-impregnated glass cloth board, irradiating an active energy to make a tack-free coating, laminating a Cu foil having a layer insulation adhesive layer, and heating so that the melting viscosity of this adhesive layer dies not fall below 10,000 poises to cure the under coating 3 integrated with the adhesive layer. |
