| 摘要 |
PROBLEM TO BE SOLVED: To enable high density integration of a surface type optical device, by combining a first board wherein an optical device is formed and a second board which is provided with a trench covering a projection part of an optical device with a projection part fit inside a trench. SOLUTION: A board 102 and a wiring board 101 of a surface light emitting semiconductor laser (VCSEL) are positioned to set a projection part of a VCSEL 104 inside a trench of the wiring board 101. Positioning is made possible since the trench functions as a guide. When anisotropic conductive resin is used for bonding of the both, conduction is made possible for a compression surface alone and conduction of a side surface of a trench can be prevented. Anisotropic conductive resin is polyimide adhesive containing conductive particle. The conductive resin has a property to be conductive only between an electrode and a wiring materials such as Au and Al and is not conductive transversely. Conductive particle is conductive held between two metallic materials and is not conductive in a place wherein they do not exist. |
