| 摘要 |
PROBLEM TO BE SOLVED: To prevent a lead terminal from protruding from a package by processing flatly the upper part of a resin layer which covers the whole with common resin, and cutting off each element mounting layer together with the common substrate. SOLUTION: A common substrate 30 after die bonding and wire bonding are finished is set on a working stand, a specified amount of liquid resin 52 is dripped from above the substrate 30 with the use of a dispenser 51. A dicing equipment is used, the resin 52 is planed, and a flat surface is formed with a dicing blade 54 in such a manner that the surface of resin 52 is at a fixed height from the common substrate 30. Each element mounting part of the resin 52 is cut off, and each of the elements is separated. In the case of a lead frame, a back board is eliminated in advance before separation. That is, each of the element-mounting parts is divided and cut off by the dicing blade 54, along cutting lines D1, D2, D3... for separation by an island and a region surrounding a lead terminal connected with a semiconductor chip 39 fixed on the island. |
