发明名称 |
ELECTRONIC PART MOUNTER AND MOUNTING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide an electronic part mounter and a mounting method in which an offset amount of a main component, i.e., a positional shift due to thermal expansion, is determined and offset correction of a mounting data is performed without stopping the mounting operation. SOLUTION: An offset amount data corresponding to the temperature is stored in a data storing section 12 for each main component pertaining to the mounting accuracy. Temperature of the main component is measured at a temperature measuring part 2 before mounting on a circuit board is started and an offset amount corresponding to the temperature is determined based on the measured data with reference to a data stored in the data storing section 12. A control section 1 corrects the data of a mounting program with the offset amount thus determined before starting the mounting operation. |
申请公布号 |
JPH11186795(A) |
申请公布日期 |
1999.07.09 |
申请号 |
JP19970350293 |
申请日期 |
1997.12.19 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
MORI TETSUYA;MORIMOTO KENJI;KURATA HIROAKI |
分类号 |
H05K13/04;G05B19/18;G05B19/404 |
主分类号 |
H05K13/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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