| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which has low resistance with no deformed via hole conductors which are at least formed by being filled with metal grains. SOLUTION: Via hole conductors 3 charged with at least grains 4 of a low- resistance metal such as Cu are disposed in an insulation board contg. at least an org. resin and has via conductors 3. A pulse current applied to the via hole conductors 3 is controlled to mutually bond the metal grains 4 through necks 5 having a width 0.1-0.9 times as much as the mean grain size of the grains 4 to form a three-dimensional net structure of the conductors 3, thereby forming a wiring board. |
