发明名称 MANUFACTURE OF METAL-CORE MULTILAYER SHIELD BOARD
摘要 PROBLEM TO BE SOLVED: To shorten the manufacturing time by laminating Cu foils on both outermost faces of a primary prepared set of boards, through insulation layers to prepare a second prepared set, and heat treating the secondary prepared set in an integratedly laminated form. SOLUTION: The manufacturing method comprises combining first insulation layers 21 with inner layer boards 521, 522 having circuits 531, 532 formed arbitrarily in Cu foils of double-side Cu-lines laminate boards, on both outer surfaces of an Al core 10 to prepare a prim. board 50 in which a first sets 551, 552 are stacked each one by using positioning pins 54. Cu foils 62 are laminated on both outer surfaces of the board 50 through a third insulation films 61 to prepare a sec. board 60, which is heated and pressed to laminate and integrate them to obtain an Al core shield board 70 having [6+(N-1)×4] layer (in which N is number of combined boards at one side). This simplifies the process and reduces the working time to improve the working efficiency.
申请公布号 JPH11186722(A) 申请公布日期 1999.07.09
申请号 JP19970356995 申请日期 1997.12.25
申请人 MITSUBISHI PLASTICS IND LTD 发明人 SANO MITSUTOSHI;KAJIYASHIKI MAKOTO;IWASAKI KANAME
分类号 H05K1/05;H05K3/46;H05K9/00;(IPC1-7):H05K3/46 主分类号 H05K1/05
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