发明名称 |
RADIATION SENSITIVE COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To ensure high photosensitivity and high resolution and to obtain a good pattern shape by incorporating a resin having acid decomposable protective groups and a compd. having acyloxyalkoxy groups. SOLUTION: The radiation sensitive compsn. contains an alkali-soluble resin or a resin having acid decomposable protective groups on at least part of the alkali solubility imparting groups of the resin and a compd. having two or more acyloxyalkoxy groups in one molecule. When the compsn. is applied to a substrate and heated, the alkali-soluble parts of the resin (base resin) which occupies the majority of the compsn. and the acyloxyalkoxy groups (heat crosslinker) cause an exchange reaction. The base resin is crosslinked, the mol.wt. of the resin is increased and the resin is made slightly soluble in an alkali developer. |
申请公布号 |
JPH11184089(A) |
申请公布日期 |
1999.07.09 |
申请号 |
JP19970356817 |
申请日期 |
1997.12.25 |
申请人 |
MITSUBISHI CHEMICAL CORP |
发明人 |
FUJITA ATSUSHI;KAMEYAMA YASUHIRO;TARUYA SHINJI |
分类号 |
G03F7/004;G03F7/039;H01L21/027;(IPC1-7):G03F7/039 |
主分类号 |
G03F7/004 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|