发明名称 BRANCHING FILTER MULTI-LAYER SUBSTRATE PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide the branching filter multi-layer substrate package where length of wiring is reduced, number of crosses among connection networks is decreased to the utmost, increase in an insertion loss at configuration of a branching filter is minimized and the insertion loss of the branching filter is reduced by providing the connection network among SAW filters, matching lines and LC filters into a multi-layer substrate. SOLUTION: A SAW transmission filter 206, a SAW reception filter 207, lumped constant components (L1, C1, CD1), (L3, C3, CD3), (L4, C4, CD4) are mounted on a 1st layer 300 of a multi-layer substrate. A wiring pattern for connection of the SAW transmission filter 206, a SAW reception filter 207, lumped constant components (L1, C1, CD1), (L3, C3, CD3), (L4, C4, CD4) mounted on the 1st layer 300 of the multi-layer substrate is provided to a 2nd layer 400 of the multi-layer substrate. Moreover, a strip line whose line length isλ/4 that is required to configure the branching filter with the SAW transmission filter 206 and the SAW reception filter 207 is provided to a 3rd layer 500 of the multi-layer substrate.
申请公布号 JPH11186872(A) 申请公布日期 1999.07.09
申请号 JP19970356457 申请日期 1997.12.25
申请人 OKI BUSINESS CO LTD;OKI ELECTRIC IND CO LTD 发明人 MASHITA AKIRA;TERADA SATOSHI;SHIMAMURA HAJIME;FUJITA YOSHIAKI;KOMAZAKI TOMOKAZU
分类号 H01P1/213;H03H7/46;H03H9/25;H03H9/72;(IPC1-7):H03H9/72 主分类号 H01P1/213
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