| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of an IC module, which does not give damages to a lead frame when a runner is removed, and does not obstruct the conveyance of the lead frame in a process performed later. SOLUTION: When an IC chip, which is mounted on a hoop-like lead frame, is formed with resin, a neck part 1 is provided on a runner 9 to be used to feed a resin composition. In addition, the thickness of the neck part is increased by 1.2 times or less the thickness of the lead frame 11, and a notched part 8 is provided on the part where a runner is provided, when the lead frame 11 is formed with resin. |
