| 摘要 |
PROBLEM TO BE SOLVED: To mount a semiconductor device on a printed board with high reliability so that no problem may be raised. SOLUTION: A semiconductor device is provided with a metallic substrate 8 composed of a metallic plate 5, an insulating film 6 coating the surface of the plate 5, and a conductor pattern 7 formed on the film 6, a semiconductor chip 2 die-bonded to the substrate 8, gold wires 9 respectively wire-bonded to electrodes on the chip 2 and electrodes on the conductor pattern 7, and a resin 3 sealing the chip 2 and the wires 9. The conductor pattern 7 is arranged on the flat part of the substrate 8, and a groove 1 is provided on the side face of the sealing resin 3 corresponding to an external electrode 4 exposed from the pattern 7. Therefore, the reliability of the semiconductor device is improved, because no bending stress occurs in the pattern 7. In addition, the semiconductor device can be mounted surely on a printed board at the time of mounting the device on the board, because solder is sucked up through the groove 1 by a capillary phenomenon. |
