RESIST DEVELOPING METHOD BY MAGNETIC FIELD CONTROL, RESIST DEVELOPING EQUIPMENT, AND MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for improving uniformity of a resist profile developed in a semiconductor wafer surface. SOLUTION: Resist is spread on the base layer formed on a semiconductor substrate 10, and exposed to light. Alkaline developer is brought into contact with the resist. A resist pattern is formed by developing the resist while applying a magnetic field to the alkaline developer. The resist pattern is used as a mask, and a semiconductor device is manufactured by etching the base layer on the semiconductor substrate 10.