CHIP-SHAPED ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a chip-shaped electronic component which is capable of sharply improve mounting density. SOLUTION: For a substrate 1, both sides faces 11 and 12 in a longitudinal direction X and both side faces 13 and 14 in a lateral direction Y cross each other. Outer electrodes 21 and 22 are severally installed only at both ends in the longitudinal direction X of the substrate 1 and are made to be electrically continuous with circuit elements and intervals d11 and d12 and d21 and d22 apart from both side faces 13 and 14 in the lateral direction Y.