MOLDED ELECTRONIC PACKAGE, METHOD OF PREPARATION AND METHOD OF SHIELDING

摘要

An improved way of preparing packaged electronic circuitry using molded plastics (1), Thick Film (3), and Polymer Thick Film technology, and achieving shielding of the circuitry and components (2) of the package. In this invention at least one of the electronic devices (2) in the package is supported in a molded pocket (1) in the molded substrate (1), and circuit traces are added to the surface of the substrate and the electronic device, simultaneously creating the circuit traces and making the interconnections with the components at the same time. Shielding, which is optional, can easily be printed over the planar surface of the packaged circuit traces and components.