| 摘要 |
<p>A ceramic microelectronic package (200) suitable for housing high-frequency electronic devices, and a process for making such a package, are disclosed herein. The package includes a base (102), a ceramic circuit substrate (106) attached to a top surface of the base and having a first cavity for receiving a high-frequency electronic device (116), and conductive patterns (202) deposited on a surface of the circuit substrate. The patterns (204) include signal patterns and flanking ground patterns forming at least a portion of co-planar waveguide (CPW) transmission lines. Each signal pattern is preferably a signal trace, and each ground pattern may be a ground trace or plane. The ground patterns may each have a portion exposed outside the package for external connection to electrical ground. Alternately, the ground patterns may be internally connected to a ground plane formed by the base, when the base is at least partially conductive, by conductive via openings or bonding wires passing through ears cut into a perimeter of the circuit substrate. The base may also be non-conductive such that the transmission line is a suspended CPW transmission line. The package may include a ceramic seal ring (110) substrate attached to the circuit substrate and having a second cavity larger than the first cavity, and a ceramic lid (114) attached thereto such that the transmission line forms a CPW, embedded CPW, and CPW transmission line. Alternatively, the package may include a dielectric sealing cap attached to the circuit substrate and having a chamber larger than the first cavity such that the line again forms a CPW, embedded CPW, and CPW transmission line.</p> |
