| 摘要 |
<p>A semiconductor device (14) comprising a substrate (10) which does not warp and is made of an insulator, connection terminals formed on the substrate (10), a semiconductor chip (12) mounted on the substrate (10) by flip-chip connection between the connection terminals and electrodes of the semiconductor chip (12), and an underfilling agent (18) with which the gap between the substrate (10) and the semiconductor chip (12) is filled, wherein none of the sides of the substrate (10) is parallel to any of the sides of the semiconductor chip (12), and none of the diagonals (T) of the semiconductor chip (12) does not overlap with any of the diagonals (S) of the substrate (10).</p> |
