发明名称 INSPECTION DEVICE FOR SUBSTRATE TO BE MEASURED
摘要 PROBLEM TO BE SOLVED: To lower the cost of an inspection device by providing an alignment means aligning a received substrate to be measured while selectively displacing the substrate to be measured in a horizontal state and in an inclined state to simplify the constitution of the device. SOLUTION: An air cylinder 96 is extended and a link stage 60 is rotated around the axial line of a shaft 94 and an alignment stage 54 is inclined in a state in which a substrate to be measured 12 is attracted to an attracting pad 70 and the state of the substrate 12 is changed from the horizontal state to the inclined state. In this state, the transferring of the substrate 12 to an alignment mechanism and a relay mechanism is performed. When the substrate 12 is transferred from the alignment mechanism to the relay mechanisms, the first movable body of one side of either of a first or a second relay mechanism is moved to a first position where a transfer with respect to a measuring stage is to be performed and the first movable body of the other side is moved to a second position where a transfer with respect to the alignment mechanism is to be performed.
申请公布号 JPH11183863(A) 申请公布日期 1999.07.09
申请号 JP19970364770 申请日期 1997.12.22
申请人 MICRONICS JAPAN CO LTD 发明人 FUJIWARA SHINJI;FURUKAWA JUNICHI;KOSAKA YUTAKA;OISHI KAMIHITO
分类号 G02F1/13;G09F9/00;H01L21/677;H01L21/68;(IPC1-7):G02F1/13 主分类号 G02F1/13
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