| 摘要 |
PROBLEM TO BE SOLVED: To enable thermosetting resin encapsulation, wherein press pins are not required and a molding process is short by setting a gate position and an injection angle, wherein injection sealing resin does not abut directly against a semiconductor element and/or a passive element. SOLUTION: A gate 25 position and an injection angle from the gate 25 are so adjusted that encapsulating resin injected toward a semiconductor element and/or a passive element does not abut directly against them. When the gate 25 is positioned as shown by an arrow A, the injection resin does not abut against a protective resin 24 and/or circuit elements but faces downward in the vicinity of the opposite side of the gate 25, and generates the action pressing a hybrid integrated circuit board 1. When at least the height of the board 1 surface is set lower than the bottom surface of the gate 25, the injection resin does not abut against the board side surface, so that permeation into the board rear can be prevented. In this gate 25 position, the injection resin acts to press the board 1 to the lower metal mold 22, so that press pins are not required. |
