| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of easily making a fine metallic electronic circuit pattern which can make the pattern image of a highly fine metallic film high in equality of thickness and little in fluctuation of line width at low cost. SOLUTION: A metallic film is deposited on a substrate by bringing alkaline aqueous solution, which contains water-soluble metallic compounds and reductive compounds and is prepared so that the oxidation potential of the reductive compounds may be +100-700 mv(SCE), into contact with a substrate which has a fine resist pattern being made using the photoresist material at the surface. Then, the resist pattern is exfoliated to form a fine metallic film pattern. |
