发明名称 Semiconductor component, e.g. DRAM, containing capacitor
摘要 The component has a semiconductor substrate (1) with an insulating film (59) deposited on its main surface extending from a memory cell to a peripheral circuit region. A lower capacitor electrode (170a) formed on the substrate main surface extends upwards on the side of the insulating film surface into the memory cell region. A top capacitor electrode (151) formed on the lower electrode over a dielectric layer extends to the top surface of the insulating film. A part of the lower capacitor electrode has top (301) and bottom (302) surfaces, between which an insulating film top surface is located.
申请公布号 DE19836965(A1) 申请公布日期 1999.07.08
申请号 DE1998136965 申请日期 1998.08.14
申请人 MITSUBISHI DENKI K.K., TOKIO/TOKYO, JP 发明人 TANAKA, YOSHINORI, TOKIO/TOKYO, JP;SHIMIZU, MASAHIRO, TOKIO/TOKYO, JP;ARIMA, HIDEAKI, TOKIO/TOKYO, JP
分类号 H01L21/8242;H01L27/108;(IPC1-7):H01L27/108 主分类号 H01L21/8242
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