发明名称 |
KOMPOSISI-KOMPOSISI BAHAN PEREKAT KONDUKTIF ANISOTROPIK |
摘要 |
A novel thermally reworkable anisotropic conductive adhesive composition for attaching a semiconductor device to a substrate is provided. The composition comprises (a) a thermally reworkable crosslinked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and (b) at least one electrically conductive material present in an effective amount to provide a conducting medium in only one direction. |
申请公布号 |
ID21670(A) |
申请公布日期 |
1999.07.08 |
申请号 |
ID19990000526 |
申请日期 |
1997.12.15 |
申请人 |
SHELL INTERNATIONALE RESEARCH MAATSCHAPPIJ B.V |
发明人 |
SHRIDHAR RATNASWAMY IYER;PUI KWAN WONG |
分类号 |
C09J201/00;C09J9/02;C09J201/06;H05K3/32;(IPC1-7):C09J9/02 |
主分类号 |
C09J201/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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