An integrated circuit (500) is provided. The integrated circuit includes a substrate and at least one dielectric layer and a metal layer formed on the substrate. The at least one dielectric layer includes a terminal dielectric layer (508). The integrated circuit further includes a planar passivating layer (506) formed upon the terminal dielectric layer.
申请公布号
WO9934440(A1)
申请公布日期
1999.07.08
申请号
WO1998US25467
申请日期
1998.12.01
申请人
INTEL CORPORATION;SESHAN, KRISHNA;MIELKE, NEAL, R.