| 摘要 |
<p>The apparatus comprises a monitoring probe 52, 58 and 60 which, when the apparatus is in use, is disposed in an annular recess 42 formed in a rotatable polishing table 30 with an upturned free end 58 lying adjacent to the surface of the wafer 12 being polished. Preferably the probe 52, 58 and 60 has an optical monitoring capability and has an air jet to keep its free end 58 clean along with drainage channels (88, Fig. 5) formed in the table 30 to direct polishing slurry out of the recess 42. The polishing table 30 is covered with a unitary polishing pad 34, the part of the pad covering the recess 42 then being removed to expose the recess 42 and divide the pad into two portions 34a and 34b. Optionally, mounting means 54 enable the probe 52, 58 and 60 to be rotated out of the recess 42 when not in use. Figures 8 and 9 show alternative arrangements of the probe.</p> |
