发明名称 |
APPARATUS FOR MANUFACTURING ADHESIVE LAYER, APPARATUS FOR MANUFACTURING DOUBLE-SIDED SUBSTRATE, AND APPARATUS FOR MANUFACTURING MULTI-LAYERED SUBSTRATE |
摘要 |
<p>It is an object to provide an apparatus for manufacturing adhesive layers which can be manufactured in a manufacturing process which is fine, which exhibits an excellent mounting efficiency, which does not require a plating process and which is clean, double-sided substrates and multilayer substrates. A bonding-layer forming portion (5) incorporates a bonding portion (1), a hole machining portion (2), a charging portion (3) and a separating portion (4). A double-sided-substrate forming portion incorporates a bonding portion (6), a hole machining portion (7), a charging portion (8) and a separating portion (9), further incorporating a laminating portion (10), a resin hardening portion (11) and a pattern forming portion (12). The apparatus for manufacturing the multilayer substrate has a multilayer laminating portion (13), a resin hardening portion, a resin hardening portion (14) and an outer-layer-patter forming portion (15) to follow the bonding-layer forming portion (5) and the double-sided-substrate forming portion (16). <IMAGE></p> |
申请公布号 |
EP0928129(A1) |
申请公布日期 |
1999.07.07 |
申请号 |
EP19980917677 |
申请日期 |
1998.04.24 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
OCHI, AKIO;KATO, KANJI;TANIZAKI, TOSHIO;WADA, AKIRA;HAYASHI, HIDENORI |
分类号 |
B32B37/20;H05K3/00;H05K3/40;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
B32B37/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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