发明名称 EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR APPARATUS
摘要 PROBLEM TO BE SOLVED: To obtain the subject composition having excellent hardening properties and mold releasability, and capable of giving a hardened product excellent in moldability and storage stability by compounding an epoxy resin, a hardener, an inorganic filling material and a specific organic phosphorus compound as a hardening accelerator. SOLUTION: This composition is obtained by compounding (A) an epoxy resin (e.g. a novolac-type epoxy resin), (B) a hardener (e.g. a resol type phenolic resin), (C) an inorganic filling material (e.g. fused silica) and (D) an organic phosphorus compound (e.g. a compound of formula III) expressed by formula I R<1> is H or the like; (n)=0-5; X is (CH2 )p [(p)=3-12] or a group expressed by formula II [R<2> is H or the like; (q) and (r) are each 0-12; (m)=0-4]} as a hardening accelerator. In the above composition, the component C and the component D are preferably compounded in an amount of 200-1200 pts.wt. and 0-500 pts.wt., respectively, based on 100 pts.wt. of the total of the component A and the component B.
申请公布号 JPH11181236(A) 申请公布日期 1999.07.06
申请号 JP19970366500 申请日期 1997.12.24
申请人 HOKKO CHEM IND CO LTD;SHIN ETSU CHEM CO LTD 发明人 OHASHI KENJI;ISHIZAKI TATSUYA;UMENO MASAYUKI;ASANO HIDEKAZU;OSADA MASAKAZU;TOMIYOSHI KAZUTOSHI;SHIOBARA TOSHIO
分类号 C08K5/50;C08L63/00;H01L23/29;H01L23/31;(IPC1-7):C08L63/00 主分类号 C08K5/50
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