| 摘要 |
A semiconductor device includes a flip-chip substrate carrying thereon a conductor pattern and an insulation film, a cutout formed in the insulation film so as to expose a part of the conductor pattern, a semiconductor chip mounted on the flip-chip substrate and carrying electrodes in electrical contact with the conductor pattern exposed by the cutout, and a resin layer filling a space formed between the semiconductor chip and the flip-chip substrate, wherein the cutout is provided in correspondence to the electrodes and extends continuously to form a closed loop.
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