发明名称 |
Enhanced cooling of a heat dissipating circuit element |
摘要 |
An arrangement for cooling a heat dissipating circuit element mounted to a first side of a printed circuit board. A heat dissipation member is mounted to the other side of the circuit board and a thermally conductive post secured to the heat dissipation member extends through an aperture through the circuit board and into thermal contact with the circuit element.
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申请公布号 |
US5920458(A) |
申请公布日期 |
1999.07.06 |
申请号 |
US19970864980 |
申请日期 |
1997.05.28 |
申请人 |
LUCENT TECHNOLOGIES INC. |
发明人 |
AZAR, KAVEH |
分类号 |
H01L23/367;H05K1/02;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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