| 摘要 |
PROBLEM TO BE SOLVED: To simplify operation, so that dynamic balance of a groove roller can be adjusted, and attain the improvement of flatness of a wafer and reduction of a rate of occurrence of a wire break in cutting ingot. SOLUTION: In the case of adjusting dynamic balance of each groove roller 12, along an annular guide groove 51, a pair of balance weights 50, on an outer surface of an end plate part 40a of each sleeve end plate 40, are turned clockwise or counterclockwise, to be balanced, so that by simple operation, dynamic balance of the groove roller 12 can be adjusted. In this way, the improvement of flatness of a wafer and reduction of a rate of occurrence of a wire break in cutting ingot are attained. |
