| 摘要 |
PROBLEM TO BE SOLVED: To prevent the decreasing of a polishing speed, in the case of fall out of diamond in a conditioner surface, avoid the generation of a scratch in a wafer surface by fall out chips. SOLUTION: This device has a polishing pad 1 stuck to a rotary table 2, wafer 3 opposing a surface to the polishing pad 1 to be held to a wafer carrier 4, and a conditioner 6 brought into pressure contact with the polishing pad 1 to swivel thereon to be driven to rotate. The rotary table 2 and the wafer carrier 4 are respectively driven, the wafer 3 is brought into pressure contact with the polishing pad 1, between the polishing pad and the wafer, slurry from a slurry supply port 5 flows in, a wafer surface is polished. In a periphery of the conditioner 6, a suction part 7 having a suction hole is mounted, polishing chips and pad chips by polishing pad conditioning are immediately recovered from the suction part. |
