INK-JET RECORDING HEAD SUBSTRATE, MANUFACTURE OF SUBSTRATE, INK-JET RECORDING HEAD, AND INK-JET RECORDING APPARATUS

摘要

PROBLEM TO BE SOLVED: To enable a high-density wiring constitution by forming a heat- generating resistance body and a wiring positioned immediately below the resistance body of polysilicon of different concentrations of impurities in the constitution wherein one of the wiring connected to the heat-generating resistance body is arranged immediately below the heat-generating resistance body via an insulating film. SOLUTION: After an SiO2 film 103 is formed on an Si substrate 102, a polysilicon 110 is formed by CVD, patterned by photolithography and etched into a predetermined shape by reactive ion etching. The polysilicon formed at this time becomes a gate material at an IC-driving part and a wiring immediately below a heat-generating resistance body of a folded wiring folded to an upper and a lower wirings at a heatgenerating resistance body part. The polysilicon is turned to have a predetermined sheet resistance value by injecting phosphorus ions or the like manner, then patterned and is provided with a through hole part 113 by ion etching. Thereafter, a polysilicon 111 is formed and a contact hole 112 is formed in the same manner.