发明名称 |
Interconnection of a carrier substrate and a semiconductor device |
摘要 |
Solder interconnection for forming connections between an integrated semiconductor device and a carrier substrate is provided. Located on the carrier substrate are electrodes and located between the electrodes and integrated semiconductor device are solder connections that have a relatively low melting point such that when the device is in operation, the solder connection will liquify thereby permitting expansion compensation between the substrate and semiconductor device.
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申请公布号 |
US5920125(A) |
申请公布日期 |
1999.07.06 |
申请号 |
US19970853942 |
申请日期 |
1997.05.09 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ELLERSON, JAMES VERNON;FUNARI, JOSEPH;VARCOE, JACK ARTHUR |
分类号 |
H01L21/56;H01L21/60;H05K3/30;H05K3/34;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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