发明名称 RESIN COMPOSITION FOR PLATING USE AND PLATED MOLDED PRODUCT
摘要 PROBLEM TO BE SOLVED: To obtain a plated molded product made of an improved AES resin- based composition capable of easy plating operation under similar conditions to those for conventional ABS resin plating operation. SOLUTION: The subject resin composition comprises a total of 100 pts.wt. of (A) 10-80 pts.wt. of a graft polymer produced by grafting an aromatic vinyl monomer and vinyl cyanide monomer or another monomer copolymerizable therewith to an ethylene-propylene-based rubber, (B) 10-60 pts.wt. of a graft polymer produced by grafting an aromatic vinyl monomer and vinyl cyanide monomer or another monomer copolymerizable therewith to an acrylic ester- biased rubber 0.1-0.3μm in weight average particle size, and (C) 10-80 pts.wt. of a copolymer produced by copolymerization between aromatic vinyl monomer and vinyl cyanide monomer or another monomer copolymerizable therewith. The other objective plated molded product is obtained by plating a resin molded product obtained by molding the above composition.
申请公布号 JPH11181217(A) 申请公布日期 1999.07.06
申请号 JP19970365877 申请日期 1997.12.22
申请人 SUMIKA ABS LATEX KK 发明人 ITO MASANORI;AOKI HIROMITSU;EGAWA HIDETOSHI
分类号 C08L25/12;C08L51/00;C08L51/06;C23C18/16;C25D5/56;(IPC1-7):C08L51/06 主分类号 C08L25/12
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