发明名称 |
RESIN COMPOSITION FOR PLATING USE AND PLATED MOLDED PRODUCT |
摘要 |
PROBLEM TO BE SOLVED: To obtain a plated molded product made of an improved AES resin- based composition capable of easy plating operation under similar conditions to those for conventional ABS resin plating operation. SOLUTION: The subject resin composition comprises a total of 100 pts.wt. of (A) 10-80 pts.wt. of a graft polymer produced by grafting an aromatic vinyl monomer and vinyl cyanide monomer or another monomer copolymerizable therewith to an ethylene-propylene-based rubber, (B) 10-60 pts.wt. of a graft polymer produced by grafting an aromatic vinyl monomer and vinyl cyanide monomer or another monomer copolymerizable therewith to an acrylic ester- biased rubber 0.1-0.3μm in weight average particle size, and (C) 10-80 pts.wt. of a copolymer produced by copolymerization between aromatic vinyl monomer and vinyl cyanide monomer or another monomer copolymerizable therewith. The other objective plated molded product is obtained by plating a resin molded product obtained by molding the above composition.
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申请公布号 |
JPH11181217(A) |
申请公布日期 |
1999.07.06 |
申请号 |
JP19970365877 |
申请日期 |
1997.12.22 |
申请人 |
SUMIKA ABS LATEX KK |
发明人 |
ITO MASANORI;AOKI HIROMITSU;EGAWA HIDETOSHI |
分类号 |
C08L25/12;C08L51/00;C08L51/06;C23C18/16;C25D5/56;(IPC1-7):C08L51/06 |
主分类号 |
C08L25/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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