发明名称 Semiconductor memory device and method of manufacturing the same
摘要 A semiconductor memory device including a semiconductor substrate having a trench; a dielectric film formed on the substrate; a storage node electrode formed on the dielectric film; a first insulating film formed on the storage node electrode corresponding to the trench; a gate electrode formed on the first insulating film; a second insulating film formed on the gate electrode; a gate insulating film formed on at least one the side of gate electrode; a semiconductor layer formed on the at least one side of the first and second insulating films; and impurity regions formed in the semiconductor layer at the sides of the first and second insulating films. A manufacturing method including the steps of etching a semiconductor substrate to form a trench; forming a dielectric film and a conductive layer on the substrate; forming a first insulating film, a gate electrode, a second insulating film, and an interconnection layer, on the conductive layer corresponding to the trench; forming a semiconductor layer on the sides of the first and second insulating films; etching the conductive layer to form a storage node; and forming an impurity region in the semiconductor layer at the sides of the first and second insulating films.
申请公布号 US5920777(A) 申请公布日期 1999.07.06
申请号 US19980111287 申请日期 1998.07.07
申请人 LG SEMICON CO., LTD. 发明人 CHOI, JONG MUN;KIM, CHANG YEOL
分类号 H01L21/8242;H01L27/108;(IPC1-7):H01L21/336 主分类号 H01L21/8242
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