发明名称 |
Semiconductor memory device and method of manufacturing the same |
摘要 |
A semiconductor memory device including a semiconductor substrate having a trench; a dielectric film formed on the substrate; a storage node electrode formed on the dielectric film; a first insulating film formed on the storage node electrode corresponding to the trench; a gate electrode formed on the first insulating film; a second insulating film formed on the gate electrode; a gate insulating film formed on at least one the side of gate electrode; a semiconductor layer formed on the at least one side of the first and second insulating films; and impurity regions formed in the semiconductor layer at the sides of the first and second insulating films. A manufacturing method including the steps of etching a semiconductor substrate to form a trench; forming a dielectric film and a conductive layer on the substrate; forming a first insulating film, a gate electrode, a second insulating film, and an interconnection layer, on the conductive layer corresponding to the trench; forming a semiconductor layer on the sides of the first and second insulating films; etching the conductive layer to form a storage node; and forming an impurity region in the semiconductor layer at the sides of the first and second insulating films.
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申请公布号 |
US5920777(A) |
申请公布日期 |
1999.07.06 |
申请号 |
US19980111287 |
申请日期 |
1998.07.07 |
申请人 |
LG SEMICON CO., LTD. |
发明人 |
CHOI, JONG MUN;KIM, CHANG YEOL |
分类号 |
H01L21/8242;H01L27/108;(IPC1-7):H01L21/336 |
主分类号 |
H01L21/8242 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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