Apparatus for cooling electronic devices using a flexible coolant conduit

摘要

An apparatus for cooling an electronic assembly. The electronic assembly is placed in thermal contact with a single, continuous and monolithic coolant conduit capable of housing a coolant. A plurality of removable cold plates are coupled to the conduit, through their indentation like openings along a peripheral edge of each plate. The conduit with plates is then bent as to complement the contour of the assembly to be cooled in a three dimensional manner as required.