| 摘要 |
The cooling apparatus (20) of the present invention is suitable for cooling electronic devices (22), and comprises a thermoelectric cooler (24) having a hot surface (26) and a cold surface (28), the cold surface (28) in thermal contact with an electronic device (22). A fluid circulator (30) is in thermal contact with the hot surface (26) of the thermoelectric cooler (24), and is capable of flowing heat transfer fluid (32) therein for transporting heat from the hot surface (26) of the thermoelectric cooler (24) to an environment remote from the electronic device (22). A thermal insulator (34) is provided for thermally isolating the electronic device (22) from a contiguous electrical circuit (36), so that the electronic device (22) is cooled substantially without condensation forming on the electronic device (22) or contiguous electrical circuit (36).
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