| 发明名称 |
Vacuum microelectronic device and methodology for fabricating same |
| 摘要 |
A vacuum state microelectronic device comprising at least a cathode, an anode, and a grid, disposed in a cavity, and formed by the wafer bonding of two planar substrates. The technology permits multiple vacuum state microelectronic devices (vacuum tubes) to be arrayed on a single substrate in an integrated manner.
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| 申请公布号 |
US5919070(A) |
申请公布日期 |
1999.07.06 |
| 申请号 |
US19960698643 |
申请日期 |
1996.08.16 |
| 申请人 |
PHILIPS ELECTRONICS NORTH AMERICA CORPORATION |
发明人 |
KHAN, BABAR A.;CAMMACK, DAVID A.;PINKER, RONALD |
| 分类号 |
H01J9/24;G02F1/13357;H01J9/00;H01J9/02;H01J9/14;H01J9/26;H01J9/28;H01J17/49;H01J19/02;H01J19/38;H01J19/54;H01J19/58;H01J19/62;H01J19/66;H01J21/10;H01J21/36;H01J61/00;H01J61/30;H01J61/82;H01J65/00;H01L21/02;H01S3/03;H01S3/097;H01S3/0973;(IPC1-7):H01J9/02 |
主分类号 |
H01J9/24 |
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