Assembly for dissipatating heat from a semiconductor chip wherein a stress on the semiconductor chip due to a thermally conductive member is partially relieved

摘要

An assembly comprising a substrate, a thermally conductive member which is spaced from the substrate, and a semiconductor chip located on a side of the substrate facing the thermally conductive member. A resilient component is compressed between the substrate and the thermally conductive member so that a force clamping the substrate and the thermally conductive member together is shared by at least the semiconductor chip and the component.