发明名称 CHIP RESISTOR
摘要 <p>PROBLEM TO BE SOLVED: To prevent occurrence of spread in printing a resistor in order to stabilize a resistance value, by forming a recess on a surface of an insulating substrate, forming a resistor in the recess, and bridging a pair of electrodes by the resistor. SOLUTION: Break grooves 1 are press-molded in the shape of a lattice on both top and bottom surface of a substrate essentially formed of alumina rectangular recesses 3 are formed in unit regions 2 partitioned by the break grooves 1, and then the substrate is fired. Subsequently, conductive paste containing silver, palladium and the like is coated opposite to both surfaces of the substrate every unit region 2, the end of top surface is printed to face onto the recesses 3, and top and bottom surface electrodes 4a and 4b are formed by firing the substrate. Resistive paste containing ruthenium oxide is printed in the recesses 3 to bridge the electrodes 4a of the top surface, and resistors 5 are formed by firing the substrate.</p>
申请公布号 JPH11176603(A) 申请公布日期 1999.07.02
申请号 JP19970336051 申请日期 1997.12.05
申请人 ROHM CO LTD 发明人 ONO SEIYA
分类号 H01C7/00;(IPC1-7):H01C7/00 主分类号 H01C7/00
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