发明名称 SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a semiconductor device which has the equivalent function as a layered semiconductor device with easy connection of a power source circuit and a ground circuit with the electrode pad of the semiconductor element forming the power source circuit and the ground circuit from a required part. SOLUTION: A device 10 is constituted of a semiconductor element 12 arranged at the central position which is equipped with pleural electrode pads including at least one pad for a power source on the surface, and a conductor circuit pattern 16 equipped with conductor leads 13 directly connected with each electrode pad of the semiconductor element 12 and an outer frame 15 surrounding the plural conductor leads 13. The conductor circuit pattern 16 is provided with a conductor plate 14 at either a power source circuit or a ground circuit side in an area surrounded by the inside end parts of the plural conductor leads 13, and at least one of the conductor leads 13 is extended an connected with the conductor plate 14.</p>
申请公布号 JPH11177012(A) 申请公布日期 1999.07.02
申请号 JP19970363934 申请日期 1997.12.16
申请人 MITSUI HIGH TEC INC 发明人 FUJITA KATSUFUSA
分类号 H01L23/50;H01L23/12;(IPC1-7):H01L23/50 主分类号 H01L23/50
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