| 摘要 |
PROBLEM TO BE SOLVED: To simplify a manufacture of circuits, by a method wherein a conductor path of another wiring layer is brought into connection contact with an expanded part of a first wiring layer, and there is provided a contact face for an output signal of an emulation circuit additional to an integrated circuit in the conductor path of another wiring layer, and the contact face is connected to an external connection terminal. SOLUTION: An emulation deformation example differs from a mass production chip in next points. Namely, another connection layer 10 is disposed isolatedly due to another isolation layer on an upmost connection layer 6. As contact 12, a conductor path of a level 10 is connected to a conductor path of a level 6. By the additional wiring layer 10 and the contact 12, a signal which is not introduced outward in a product chip is guided to a chip face. These signals, can be fetched out to outward via contact connection parts 14, 15, thereby manufacturing an emulation circuit by a much simpler method. |
