| 摘要 |
PROBLEM TO BE SOLVED: To provide a BGA semiconductor device, which is capable of realizing the structure of a tap BGA package for multiple-pin applications which is superior in reliability, heat radiating and mounting and the mounting structure of the BGA semiconductor device. SOLUTION: In a TAB tape 5, a semiconductor chip 6, an inner lead 2 and a pad 3 are wired to a tape and formed. The height of the surface at the opposite side of the tape side is made lower than the height of the back surface for the circuit surface at the semiconductor chip 6, and a reinforcing plate 10 made of metal is mounted on the back surface, where the pad is formed, in the TAB tape 5 by a bonding agent 11. A gap is formed at a part with the reinforcing plate 10, and a heat sink 12 is bonded to the back surface of the semiconductor chip 6 with a heat conducting bonding agent. A sealing resin 8 seals the inner lead part, including at least a bonding connecting part. A fixing resin 17 is partially provided so as to lot the air present at the heat-sink side of the sealing resin 8 escape through the gap and fixes the reinforcing plate 10 and the heat sink to each other. |
